The miniaturization and high integration of modern high-power electronic and photoelectric devices will generate a lot of heat in use, and the reliability and service life of the devices are directly related to the device temperature. Diamond is the most ideal heat sink material. Using CVD diamond heat sink can improve the cooling capacity of laser equipment integrated chip by 30%~100%. Especially suitable for occasions requiring electrical insulation.
Thermal management material, with ultra-high thermal conductivity, stable chemical properties and insulating properties